ROSA Fiber Optical Module Receiving Component
The optical sub-module can be further subdivided into a Transmitter Optical Subassembly (TOSA) and a Receiver Optical Subassembly (ROSA).
The optical transmission module is divided into a single-mode optical transmission module and a multi-mode optical transmission module. The overall product architecture includes an optical sub-assembly (OSA) and an electronic sub-assembly (ESA). First, the epitaxial portion is made of gallium arsenide (GaAs), indium phosphide (InP), indium gallium arsenide (InGaAs), etc. as a light-emitting and photo-detecting material, and metal-based vapor deposition (Metal-Organic Chemical Vapor Deposition; MOCVD). ), etc., to make the Lei wafer. In the chip process, the wafer is polished and made into a laser diode. Subsequently, the laser diode, with a filter, a metal cover and other components, is packaged into a TO can (Transmitter Outline can), and then the TO can and the ceramic sleeve are packaged into an optical sub-module (OSA). Finally, the electronic sub-module (ESA) is included, and the electronic sub-module includes two driving ICs for driving and receiving the laser diode and the photodetecting diode, so that the optical transmission module is combined.
The main performance indicators of ROSA are, sensitivity (Sen) and so on. The sensitivity is commonly used in dBm, which means that under certain conditions, ROSA can receive the minimum optical power value, such as Sen ≤ -27dBm.
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