SFP COB Non-hermetically Sealed
Since the compressed data center market began to demand scale, the packaging of optical modules has begun to appear in COB non-hermetic packaging. The application of COB technology also enables optical modules to realize the advantages of automated scale manufacturing in packaging.
COB (chip on board) non-hermetically sealed. It is the package form where the chip is bound directly on the PCB. The optoelectronic chip is directly inserted into the circuit board with a silver-containing epoxy resin, and the circuit is connected by wire bonding. Finally, the epoxy chip or the styrene resin (Silicone) is drip-sealed.
The benefit of this non-hermetically sealed process is that automation can be used. The application of COB technology in the field of optical communication also enables optical modules to realize the advantages of automated scale manufacturing in packaging.
At present, COB technology is widely used in short-range communication module products using VCSEL modules. High-integration silicon optical products are also packaged with COB technology.